company blog about Supply Molex Board-To-Board Connector:NeoPress Connector,SpeedMezz Connector,Mini-Fit Connector

Supply Molex Board-To-Board Connector:NeoPress Connector,SpeedMezz Connector,Mini-Fit Connector

Shenzhen Mingjiada Electronics Co., Ltd. is a world-renowned authorized independent distributor of electronic components. The company has sufficient supply, excellent price and fast delivery, and wholeheartedly provides high-quality electronic component supply services for the majority of end customers and distributors.

Main business: integrated circuit IC, 5G chip, new energy IC, Internet of Things chip, Bluetooth chip, automotive chip, artificial intelligence IC, Ethernet IC, memory chip, sensor, IGBT module and other products.

Supply advantages:
The company has 2 million models in stock, which can quickly respond to customer needs; Relying on the warehousing systems in Shenzhen, Hong Kong and other places, we will realize a 72-hour global delivery network with rapid response; All products come from the original factory channel, providing complete model traceability and warranty services.

NeoPress Series Board-to-Board Connector
The NeoPress series is a high-performance board-to-board connector from Molex designed for demanding application environments that require high reliability and easy installation.

Technical features:
INNOVATIVE CRIMPING TECHNOLOGY: The NeoPress series adopts a unique crimp-type terminal design to achieve reliable connection between PCB and connector without soldering, greatly simplifying the assembly process and improving production efficiency. This design is particularly suitable for large-scale applications in automated production lines.
High-density layout: Provides a variety of pin configuration options, supports different pitch specifications from 0.8 mm to 2.0 mm, and adapts to various circuit board layout needs. The high-density design achieves maximum signal transmission capabilities in confined spaces.
Excellent electrical performance: The working voltage can reach 300V, the rated current is 3A, and the contact resistance is less than 20mΩ, ensuring the stability and integrity of signal transmission. Products meet UL and CSA safety standards and meet industrial-grade application requirements.
Environmental Adaptability: Operating temperature range-40 °C to + 105 °C, with good vibration and impact resistance, suitable for harsh industrial environments. Some models are also dustproof and waterproof, and the protection level can reach IP67.

Typical application scenarios:
Industrial automation equipment: NeoPress connectors are widely used in PLC controllers, industrial PCs, HMI human-machine interfaces and other equipment to achieve reliable connections between control boards and I/O modules. Its anti-vibration characteristics are particularly suitable for factory automation environments.
Communication infrastructure: In communication devices such as 5G base stations and optical transmission equipment, the NeoPress series is used for interconnection between motherboards, radio frequency modules, and power modules, and supports high-speed data transmission.
Medical electronic equipment: Thanks to its solderless design and reliable electrical performance, NeoPress connectors are used in medical electronic products that require extremely high reliability, such as medical imaging equipment and patient monitoring systems.
Rail transit systems: In applications such as train control systems and signaling equipment, NeoPress connectors can withstand long-term vibration and temperature changes, ensuring the safe operation of the transportation system.

SpeedMezz Series High Speed Board-to-Board Connectors
The SpeedMezz series is a high-performance board-to-board connectivity solution developed by Molex for high-speed data transmission applications.

Core technological innovation:
Ultra-high bandwidth support: SpeedMezz connector supports high-speed signal transmission of 56Gbps and above, is compatible with the latest transmission protocols such as PCIe 5.0 and USB4, and the differential impedance is controlled at 100 Ω ± 10% to ensure signal integrity.
Innovative shielding design: It adopts fully armored structure and optimized grounding layout to effectively suppress electromagnetic interference (EMI), and the anti-interference ability is ≥ 60 dB, meeting the strict requirements of high-speed digital systems for signal purity.
High-density interconnection: Typical models such as 45971-2115 provide 200 contacts with a pitch of only 1.27 mm, enabling a high-density layout in a compact space, especially suitable for modern electronic devices with constrained space.
Flexible stacking height: Supports multiple stacking height options from 7mm to 12mm, such as 7mm, 7.5 mm, 8mm, 8.5 mm, 9.5 mm, 10mm and 12mm, adapting to different PCB pitch needs.
Reliable contact system: The contacts are gold-plated with a thickness of 30.0 µ in (0.76 µ m), ensuring long-term stable electrical connections with more than 500 plug-in and unplug life.

Typical application areas:
Data center equipment: SpeedMezz connectors are widely used in servers, storage arrays and network switches to realize high-speed interconnection between motherboards and expansion cards, backplanes and line cards, and support cloud computing and big data applications.
5G communication equipment: In AAU (Active Antenna Unit) and BBU (Baseband Unit), the SpeedMezz series is used for high-density connection between the motherboard and the RF front-end module, and supports millimeter wave high-frequency signal transmission.
High-end testing instruments: Precision testing equipment such as digital oscilloscopes and spectrum analyzers use SpeedMezz connectors to achieve high-speed data exchange between internal modules to ensure measurement accuracy.
Artificial intelligence hardware: High-performance computing devices such as AI accelerator cards and GPU clusters rely on high-bandwidth interconnections provided by SpeedMezz connectors to meet the needs of parallel processing of massive data.

Mini-Fit Series Board-to-Board Connector
The Mini-Fit series is Molex's classic high-current board-to-board connection solution.

Product features and advantages:
High current carrying capacity: Mini-Fit connectors support current transfer from 5.0 A to 17.0 A, contact resistance as low as 10mΩ and voltage levels up to 600V, making them a reliable choice for power distribution.
Diversified terminal configurations: Provides a variety of pin configurations from 2 to 24 bits, such as Mini-Fit Jr. ™, Micro-Fit ™ and other series, to meet the application needs of different power levels.
Safety Locking Mechanism: Integrated Forward Locking (TPA) and Terminal Position Assurance (CPA) functions prevent terminal fretting and accidental falling off, ensuring connection reliability in vibrating environments.
Wide temperature adaptability: operating temperature range-40 °C to + 105 °C, some models can reach 125 °C, suitable for high temperature environments such as automotive engine compartments.
Environmental compliance: Complies with RoHS and REACH standards, and meets the requirements of modern electronic manufacturing for green environmental protection.

Main application scenarios:
Power supply system: In equipment such as server power supply, industrial power supply, etc., Mini-Fit connector is used for power distribution between PCBs, supporting high current transmission.
New energy vehicles: It is used in key components such as battery management systems (BMS) and on-board chargers, connecting control boards and power modules, and is subject to vibration and temperature changes in the vehicle environment.
Industrial motor drive: In frequency converters, servo drives and other equipment, the Mini-Fit series realizes the interconnection of control boards and power modules and supports high-current switching.
Household appliances: High-power white goods such as air conditioners and washing machines use Mini-Fit connectors to achieve reliable connection between the control board and the actuator.