company blog about Acquisitions Lattice Video Connection FPGA:CrossLink,CrossLink-NX

Acquisitions Lattice Video Connection FPGA:CrossLink,CrossLink-NX

Shenzhen Mingjiada Electronics Co., Ltd. is a strong global electronic components inventory recycler, recycling factories, individuals and agents backlog of electronic components inventory, long-term recycling of 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, Internet of Things ICs, automotive ICs, automotive grade ICs, communication ICs, artificial intelligence ICs, memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet IC, WiFi chips, wireless communication modules, connectors and a series of products.

Specific recycle process:
1. You can simply classify your IC/module stocks and identify the model, brand, production date, quantity, etc.
2. Please send your inventory list to our evaluation team by fax or e-mail.
3. When you receive the purchase offer from one of our professionals, we can negotiate the specific transaction method and delivery and reach an agreement.
4. We only recycle from regular channels, such as agents, traders, and factories, and do not accept irregular sources.

CrossLink:Low power FPGA featuring hardened MIPI D-PHY, LVDS, SLVS, subLVDS, & Open LDI bridging

Small Footprint, Big Features – Do you need to bridge, aggregate, or split signals for cameras and displays? CrossLink is the most versatile device and has a footprint as small as 6 mm2.

How Low Can We Go – Up to 50% lower power than competition. < 100 mW for many use cases and the first programmable bridging solution with a built-in sleep mode.

Sets the Bar in Performance – Industry’s fastest MIPI D-PHY bridging solution supporting 4K UHD resolution at speeds up to 12 Gbps. Also supports LVDS, SLVS, subLVDS, and OpenLDI (OLDI).

Features
Two 4-lane MIPI D-PHY transceivers at 6 Gbps per PHY
15 programmable source synchronous I/O pairs for camera and display interfacing
Available in amazingly small 2.46 mm x 2.46 mm WLCSP packages and BGA packages with 0.4 mm, 0.5 mm and 0.65 mm pitch
Flexible device configuration with OTP non-volatile configuration memory and I2C/SPI programming
More than 5900 LUTs with up to 81 I/O pins
Soft IP available for multiple bridging solutions here

CrossLink-NX:Embedded Vision and Processing FPGA

Built on the Lattice Nexus Platform - Up to 75% lower power vs similar FPGAs and small form factor packaging with sizes as small as 4 mm x 4 mm.

Provides Best-in-class Performance for Vision Processing Applications - Abundant DSP resources as well as high memory to logic cell ratio (up to 170 bits per logic cell) accelerates AI inferencing.

High Speed Interfaces - 2.5 Gbps Hardened MIPI D-PHY, 5 Gbps PCIe, 5 Gbps USB 3.2, 1.5 Gbps programmable I/O, 1066 Mbps DDR3. Supporting LVDS, subLVDS, OpenLDI (OLDI), and SGMII.

Low Power Standby Mode and USB Interface - Consumes < 70 uA of current under typical standby mode.

Features
Instant-on configuration – IO configures in 3 ms, and device as fast as 8 ms
Up to two hardened 4-lane MIPI D-PHY transceivers at 10 Gbps per PHY / 2.5 Gbps per lane
Up to 37 programmable source synchronous I/O pairs for camera and display interfacing
From 4 mm x 4 mm WLCS package (0.4 mm pitch) to 17 mm x 17 mm BGA package (0.8 mm pitch)
Lowest soft error rate in its class, 100X more reliable than competition
Available in Commercial, Industrial and Automotive (AEC-Q100 qualified) temperature grades